Recieved:

24/06/2026

Accepted:

03/10/2026

Page: 

–

doi:

http://dx.doi.org/10.17515/resm2026-1779me0624rs

Views:

11

Multi-response optimization of 3D printing parameters for copper-loaded PLA-based nanocomposites using RSM

Mohaned S. J. Al-Suaidy1,2, Ali Abbar Khleif3, Muhsin J. Jweeg4, Osama A. Q. Ziada5

1Department of Smart Manufacturing, College of Production Engineering and Metallurgy, University of Technology, Iraq
2Department of Mechanical Engineering, College of Engineering, Wasit University, Iraq
3College of Mechanical Engineering, University of Technology, Iraq
4College of Technical Engineering, Al-Farahidi University, Iraq
5Department of Mechanical Engineering, Linnaeus University, Växjö, Sweden

Abstract

Fused Deposition Modeling (FDM) is widely used for functional polymer parts, yet the process-property behavior of copper-loaded filaments remains underexplored. This study maps how five FDM parameters, nozzle temperature (190-210°C), layer height (0.1-0.3 mm), infill density (20-80%), raster angle (0-90°), and print speed (40-50 mm/s), govern the ultimate tensile strength (UTS) and ultimate flexural strength (UFS) of PLActive, a commercial PLA filament containing a nano-copper additive. A face-centered central composite design of 48 runs was executed, and reduced quadratic models were fitted by backward elimination. The UTS model retained ten terms and fitted well (R² = 98.22%, R²pred = 96.83%); the UFS model kept only ID, RA, and their interaction with a weaker fit (R² = 65.41%, R²pred = 57.85%). Raster angle and infill density dominated both responses, with a significant ID×RA interaction (F = 125.79, p < 0.001 for UTS; F = 6.03, p = 0.018 for UFS). Desirability optimization (D = 0.921) located the optimum at ID = 80%, RA = 90°, LH = 0.3 mm, PS = 50 mm/s, with predicted UTS = 49.6 MPa and UFS = 73.6 MPa, driven by beads aligned with the applied load. Validation reached 52.0 MPa and 76.3 MPa, inside the 95% prediction band.

Keywords

Fused deposition modeling (FDM); Response surface methodology (RSM); Multi-response optimization; PLA nanocomposite; Copper-loaded PLA; Mechanical properties

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