Research on Engineering Structures and Materials (RESM) is pleased to announce an upcoming Special Focus Issue dedicated to the application of Digital Twin (DT) technologies and intelligent construction methods across the full lifecycle of structural engineering assets.
Digital Twin technology is rapidly reshaping structural engineering by establishing a dynamic link between physical infrastructure and virtual models. Integrating real-time sensor data, physics-based simulations, and advanced artificial intelligence enables a fundamental transition in structural management—moving from traditional passive maintenance to active sensing and intelligent decision-making.
This Special Issue aims to bring together researchers, computational engineers, and industry practitioners to showcase breakthroughs in data acquisition, system architecture, structural health monitoring (SHM), and life-cycle digitalization.
Scope and Topics
The Special Issue invites original research articles, review papers, short communications, and technical reports on topics including, but not limited to:
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Theoretical Frameworks: Conceptual architectures, physics-informed digital twin models, multi-physics simulations, and uncertainty quantification.
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Intelligent Construction: Dynamic process control, scenario modeling, precast component tracking, and BIM–Digital Twin integration.
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Structural Health Monitoring: Damage detection, localization, real-time sensor data fusion, robotic inspection, and bridge/asset management.
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AI & Data-Driven Methods: Machine learning model updating, deep reinforcement learning, computer vision, and IoT edge analytics.
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Life-Cycle & Sustainability: Infrastructure resilience prediction, retrofitting existing structures, and smart city infrastructure management.
Guest Editor
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Prof. Zhenling Liu, Henan University of Technology, China
Submission Details
Now Open for Submissions
Submission Deadline: December 1, 2026
Submission Instructions: Authors should select the section titled “SFI: Intelligent Construction” when uploading their manuscript through the journal’s submission system.
