Keywords

Abstract

Cu-alloy;

Sn-Pb solder;  

Work hardening; 

Recrystallization;

 Precipitate;

 Microstructure 

 

It has been observed that the fractional recrystallization characteristics of commercially pure copper is affected by the presence of individual or both the constituent elements of the Sn-Pb solder alloy. In order to design the experiment, commercially pure Cu, binary copper alloys (Cu-Sn and Cu-Pb) and ternary copper alloy, Cu-Sn-Pb are investigated. Cast alloys are homogenized, solution treated, and then quenched to complete the thermal treatment. In order to recrystallize, alloys are cold rolled to a 75% thickness and then annealed at 700°K isothermally for varying durations, up to 3600 seconds. In this experiment, the fractional recrystallization of annealed samples is evaluated as the normalized difference in microhardness recorded at various time steps. Additionally, in an attempt to verify the experimental results, the well-known Johnson-Mehl-Avrami-Kolmogorov equation is also used to predict the associated recrystallization behavior. From the study, it can be inferred that the presence of Sn-Pb solder-alloy elements have a positive impact on the recrystallization behavior of pure copper due to the solid solution strengthening, in which the effect of tin is greater than that of lead. Quantitative analysis indicates that recrystallization of pure Cu, Cu-Sn, Cu-Pb, and Cu-Sn-Pb alloys attains 99.4%, 95.4%, 98.4%, and 89.5%, respectively. Sn forms intermetallic with Cu but Pb does not. Additionally, Sn forms different intermetallic with impurities and has a BCC crystal structure dissimilar to the FCC of Cu and Pb. As a result, the formation of GP zones and the intermetallic phases during annealing show greater differences in the recrystallization behavior between the two approaches. By combination, microstructural studies of the cold-rolled alloys reveal the elongated grains of the second phases, and the alloys almost completely re-crystallized after 1800 seconds of annealing at 700°K.

© 2024 MIM Research Group. All rights reserved.